Volume 3 Number 5 (Sep. 2013)
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IJAPM 2013 Vol.3(5): 336-340 ISSN: 2010-362X
DOI: 10.7763/IJAPM.2013.V3.232

Multiple Regression Analysis Using ANCOVA in University Model

Maneesha and Priti Bajpai

Abstract—The government of UAE is promoting Dubai as an academic hub. Dubai International Academic City (DIAC) is a free zone area with many national and international universities promoting higher education in almost all disciplines. The aspiration of every graduating student from the university is to get a good placement. In Dubai diverse job opportunities in national and multinational organizations are available. The objective of the paper is to review the placement opportunities in Dubai for the universities offering programs in Engineering. This paper attempts to study the effect of three independent variables namely Cumulative grade point average (CGPA), Engineering disciplines and types of jobs that graduating students are offered on the dependent variable salary. Engineering discipline understudy are Mechanical, Electronics and Communication, Computer Science and Electrical and Electronics Engineering. The type of jobs taken into consideration are marketing, technical marketing, design and logistics. The concepts of Analysis of covariance (ANCOVA) and multiple regression are used for review of placement opportunities vis a vis the salary structure.

Index Terms—ANCOVA, ANOVA, fisher’s test statistic, multiple regression.

The authors are with Department of Mathematics, BITS, Pilani-Dubai Campus, Dubai, UAE (e-mail: maneesha@bits-dubai.ac.ae, priti@bits-dubai.ac.ae).

Cite: Maneesha and Priti Bajpai, "Multiple Regression Analysis Using ANCOVA in University Model," International Journal of Applied Physics and Mathematics vol. 3, no. 5, pp. 336-340, 2013.

General Information

ISSN: 2010-362X (Online)
Abbreviated Title: Int. J. Appl. Phys. Math.
Frequency: Quarterly
DOI: 10.17706/IJAPM
Editor-in-Chief: Prof. Haydar Akca 
Abstracting/ Indexing: INSPEC(IET), CNKI, Google Scholar, EBSCO, Chemical Abstracts Services (CAS), etc.
E-mail: ijapm@iap.org
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