Volume 2 Number 3 (May 2012)
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IJAPM 2012 Vol.2(3): 221-223 ISSN:2010-362X
DOI: 10.7763/IJAPM.2012.V2.95

An Inverse Transient Thermoelastic Problem of a solid Sphere Due to Partially distributed Heat Supply

D. T. Solanke

Abstract—As we know, thermal behavior of structures must be considered in many situation such as study of thermal effect on thermal strains, stresses, displacement. There is a practical requirement of solid sphere in various modern project. In this task, we endeavour to solve the differential equation of heat conduction, by applying heat flux to solid sphere of radius ‘a’ which is free from traction, when interior temperature is known. The initial temperature of the sphere is same as that of surrounding temperature, which is zero. The sphere is subjected to transient heat supply, angular symmetric i.e. along radial direction, at the outer surface. In this article, an attempt is being made to solve the differential equation of heat conduction. The result is obtained in a series form of Bessel function. The result is illustrated numerically and graphically. The obtained result may be useful in solving engineering problem, particularly for industrial problem, machines subjected to heating and cooling.

Index Terms—Inverse transient heat conduction temperature, stains, stresses, displacement.

D. T. Solanke is with the Sudhakar Naik and Umashankar Khetan College Akola,Maharashtra state, India (e-mail: solanke_dattarao@rediffmail.com).

 

Cite: D. T. Solanke, "An Inverse Transient Thermoelastic Problem of a solid Sphere Due to Partially distributed Heat Supply," International Journal of Applied Physics and Mathematics  vol. 2, no. 3, pp. 221-223, 2012.

General Information

ISSN: 2010-362X
Frequency: Bimonthly (2011-2014); Quarterly (Since 2015)
DOI: 10.17706/IJAPM
Editor-in-Chief: Prof. Haydar Akca
Abstracting/ Indexing: Index Copernicus, EI (INSPEC, IET), Chemical Abstracts Services (CAS), Electronic Journals Library, Engineering & Technology Digital Library, Nanowerk Database, Google Scholar and ProQuest
E-mail: ijapm@iap.org
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