Volume 1 Number 3 (Nov. 2011)
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IJAPM 2011 Vol.1(3): 177-180 ISSN:2010-362X
DOI: 10.7763/IJAPM.2011.V1.34

The Investigate Metallurgical Properties of Roll Bonding Titanium Clad Steel

Mohsen Saboktakin, Gholam Reza Razavi, and Hossein Monajati

Abstract—Cladding of steel with titanium alloys is used widely in aerospace, chemical and nuclear industries, to improve corrosion behavior and reduce production costs. Roll bonding is one of the solid state processes to produce this combination. In this research the high quality bonding of hot roll bonding of titanium on steel substrate was investigated in terms of metallurgical and mechanical properties. The effect of copper interlayer on preventing inter-diffusion was also evaluated. The microstructure at interface was observed by an optical and scanning electron microscope and the presence of intermetallic phases in the reaction zone was examined by X-ray diffraction on the fracture surfaces of the joints. The experimental results showed that the volume fraction of intermetallics may be controlled effectively using cupper interlayer, because there is not enough time for interdiffusion of the elements. Total thickness of intermetallic layers and microhardness at the interface increased with increasing bonding temperature.

Index Terms—Hot roll bonding, titanium, clad, metallurgical properties.

Mohsen Saboktakin, Gholam Reza Razavi, and Hossein Monajati are with Department of Materials Science and Engineering, Najafabad Branch, Islamic Azad University, Isfahan, Iran (e-mail: Mohsen.Saboktakin@Gmail.com; Reza.Razavi64@Gmail.com; Monajati@Gmail.com).

 

Cite: Mohsen Saboktakin, Gholam Reza Razavi, and Hossein Monajati, "The Investigate Metallurgical Properties of Roll Bonding Titanium Clad Steel," International Journal of Applied Physics and Mathematics  vol. 1, no. 3, pp. 177-180, 2011.

General Information

ISSN: 2010-362X
Frequency: Bimonthly (2011-2014); Quarterly (Since 2015)
DOI: 10.17706/IJAPM
Editor-in-Chief: Prof. Haydar Akca
Abstracting/ Indexing: Index Copernicus, EI (INSPEC, IET), Chemical Abstracts Services (CAS), Electronic Journals Library, Nanowerk Database, Google Scholar, EBSCO, and ProQuest
E-mail: ijapm@iap.org
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